Hydraulic Bearing CPU Cooling Fan CPU Cooler

Jointing process
This type of heat sink is first made of aluminum or copper plates as fins, and then combined with thermal conductive paste or solder on a heat dissipation base with grooves. The characteristic of the combined type radiator is that the fins break through the original proportion limit, have good heat dissipation effect, and can also be made of different materials. The advantage of this process is that the Pin Fin ratio of the radiator can reach over 60, with good heat dissipation effect, and the fins can be made of different materials. Its disadvantage lies in the interface impedance problem between the fins and the base connected by thermal conductive paste and soldering, which affects heat dissipation. In order to improve these shortcomings, two new technologies have been applied in the field of heat sinks.
Firstly, the gear shaping technology utilizes a pressure of over 60 tons to combine aluminum sheets into the base of copper sheets, and there is no medium used between aluminum and copper. From a microscopic perspective, the atoms of aluminum and copper are connected to each other to some extent, thus completely avoiding the drawbacks of traditional copper aluminum bonding resulting in interface thermal resistance and greatly improving the heat transfer ability of the product.
Secondly, there is reflow soldering technology. The biggest problem with traditional bonded heat sinks is the interface impedance problem, and reflow soldering technology is an improvement on this issue. In fact, the process of reflow soldering is almost the same as that of traditional joint type heat sinks, except for the use of a special reflow soldering furnace that can accurately set the welding temperature and time parameters. The solder is made of lead-tin alloy, which allows for sufficient contact between the welding and the metal being welded, thereby avoiding missed soldering and empty soldering, ensuring that the connection between the fins and the base is as close as possible, and minimizing the thermal resistance of the interface, It is also possible to control the melting time and temperature of each solder joint, ensuring the uniformity of all solder joints. However, this special reflow furnace is expensive, and motherboard manufacturers use it more frequently, while radiator manufacturers rarely use it. Generally speaking, radiators using this process are mostly used for high-end applications and are relatively expensive.
Flexible process
The flexible manufacturing process involves folding copper or aluminum thin plates into integrated fins using a molding machine, fixing the upper and lower bottom plates with a piercing die, and then using a high-frequency metal fusion machine to weld them into a processed base. Due to the continuous connection of the manufacturing process, it is suitable for making high thickness to length ratio heat dissipation fins. Moreover, the fins are formed as a whole, which is conducive to the continuity of heat conduction. The thickness of the fins is only 0.1mm, which can greatly reduce the material demand, And obtain the maximum heat transfer area within the allowable weight of the heat sink. In order to achieve mass production and overcome the interface impedance during material bonding, the production process adopts simultaneous feeding of upper and lower bottom plates, and the automation process is consistent. The upper and lower bottom plate bonding adopts high cycle fusion welding, that is, material fusion to prevent the generation of interface impedance and establish high-strength, closely spaced heat dissipation fins. Due to the continuous manufacturing process, it can be produced in large quantities, and due to the significant reduction in weight and improved efficiency, it can increase heat transfer efficiency.
 

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