Air Foxconn CPU Cooler with Fan

Active heat dissipation can be divided into air-cooled heat dissipation, liquid cooled heat dissipation, heat pipe heat dissipation, semiconductor refrigeration, chemical refrigeration, and so on.
Air-cooled
Air cooling is the most common way to dissipate heat, and it is also a relatively inexpensive method. Essentially, air-cooled heat dissipation is the use of a fan to take away the heat absorbed by the radiator. It has the advantages of relatively low price and convenient installation. But it is highly dependent on the environment, such as when the temperature rises and overclocking occurs, its heat dissipation performance will be greatly affected.
Liquid cooling
Liquid cooling heat dissipation is achieved by forcibly circulating the heat from the radiator through the liquid driven by the pump. Compared with air cooling, it has the advantages of quietness, stable cooling, and less dependence on the environment. The price of liquid cooling is relatively high, and installation is also relatively troublesome. When installing simultaneously, try to follow the instructions in the manual to achieve the best heat dissipation effect. Due to cost and ease of use considerations, liquid cooled heat sinks are often referred to as water-cooled heat sinks, as water is commonly used as the heat conducting liquid for liquid cooled heat dissipation.
heat pipe
Heat pipe is a type of heat transfer element that fully utilizes the principle of heat conduction and the rapid heat transfer properties of the cooling medium. It transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube, with extremely high thermal conductivity, good isotherm, adjustable heat transfer surface area on both sides, long-distance heat transfer, temperature control, and a series of advantages. The heat exchanger composed of heat pipes has high heat transfer efficiency The advantages of compact structure and low fluid resistance loss. Its thermal conductivity far exceeds that of any known metal.
Semiconductor refrigeration
Semiconductor refrigeration is the use of a specially designed semiconductor cooling sheet to generate a temperature difference when powered on. As long as the heat at the high temperature end can be effectively dissipated, the low temperature end is continuously cooled. A temperature difference is generated on each semiconductor particle, and a refrigeration sheet is formed by connecting dozens of such particles in series, thereby forming a temperature difference on the two surfaces of the refrigeration sheet. By utilizing this temperature difference phenomenon in conjunction with air/water cooling to cool the high-temperature end, excellent heat dissipation can be achieved. Semiconductor refrigeration has the advantages of low cooling temperature and high reliability. The cold surface temperature can reach below -10 ℃, but the cost is too high, and it may cause CPU condensation and short circuit due to low temperature. Moreover, the current technology of semiconductor refrigeration chips is not mature and practical enough.
Chemical refrigeration
The so-called chemical refrigeration refers to the use of some ultra-low temperature chemical substances, which absorb a large amount of heat during melting to lower the temperature. The use of dry ice and liquid nitrogen is more common in this regard. For example, using dry ice can lower the temperature to below -20 ℃, and some more "abnormal" players use liquid nitrogen to lower the CPU temperature to below -100 ℃ (theoretically). Of course, due to its expensive price and short duration, this method is often seen in laboratories or extreme overclocking enthusiasts..

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