Description
Technical Parameters
Key Specifications/ Special Features:
There are three types of thermal conductivity devices:
1: Pure copper (pure aluminum) heat conduction: This method has relatively low heat conduction efficiency, but its structure is simple and its price is cheap. Many original radiators use this method.
2: Thermal conductive copper pipe: It is still the most commonly used method nowadays. Its copper pipe is hollow and filled with a type of thermal conductive liquid. When the temperature rises, the liquid at the bottom of the copper pipe evaporates and absorbs heat, transferring it to the heat dissipation fins. After the temperature drops, it condenses into a liquid, which flows back to the bottom of the copper pipe. This cycle has high thermal conductivity efficiency, so most radiators nowadays use this method.
3: Water: It is commonly referred to as water cooling, divided into integrated water cooling and split water cooling. It takes away the heat from the CPU by water, and then the high-temperature water is blown away by the fan when passing through the winding cold exhaust (similar in structure to a home radiator), becoming cold water and circulating again.
二、 Factors affecting heat dissipation effect
Efficiency of heat transfer: The efficiency of heat transfer is the key to heat dissipation, and there are four factors that affect the efficiency of heat transfer.
1: The number and thickness of heat pipes: The more heat pipes there are, the better. Generally, 2 are sufficient, 4 are sufficient, and 6 or more are high-end radiators; The thicker the copper pipe, the better.
2: The process of heat transfer base: there are three types: heat pipe direct contact, copper bottom welding, and soaking plate.
3: Thermal conductive silicone grease: Due to manufacturing process issues, there cannot be a completely flat contact surface between the radiator base and the CPU (even if you look very flat, you can see uneven surfaces under a magnifying glass). Therefore, it is necessary to apply a layer of silicone grease with a higher thermal conductivity to fill these uneven areas to help with heat conduction. The thermal conductivity of silicone grease is much lower than that of copper, so just apply a thin layer evenly, If the coating is too thick, it will actually affect heat dissipation.
The thermal conductivity of general silicone grease ranges from 5 to 8, and there are also very expensive ones with thermal conductivity ranging from 10 to 15.
4: Process at the junction of heat dissipation fins and heat pipes; Heat pipes are inserted between fins to transfer heat to them, so the treatment process at their junction also affects thermal conductivity.
5: The contact area between fins and air
Fins bear the heavy responsibility of dissipating heat, and their task is to transfer the heat sent by the heat pipe to the air, so the fins must be as much as possible
When in contact with air, some manufacturers will carefully design some protrusions to increase the surface area of the sheet as much as possible
6: Air volume
The air volume represents the total volume of air that the fan can deliver per minute, usually expressed in CFM. The larger the air volume, the better the heat dissipation.
12cm Cooling Fan
TR4 & SP3 cpu cooler
AMD SP5 4U Active LGA 6096 CPU Cooler
Copper tube zipper fins heatsink
CPU Cooler for Intel 115X Mini-ITX
LGA1150/1155/1156 Intel mini CPU cooler
Packing and Delivery

Company Overview
Basic Information
|
Total Capitalization |
less than US$50,000 |
|
Country / Region |
China |
|
Year Established |
2014 |
|
Total Employees |
100 to 149 |
|
Business Type |
Exporter, Manufacturer, Trading Company |
Trading Capabilities
| Total Annual Sales | less than US$50,000 |
| Export Percentage | 90 percent to 94 percent |
| OEM Services | Yes |
| Small Orders Accepted | Yes |
| Brand Names | Innolead |
| Payment Terms | TT |
| Main Competitive Advantages | Experienced R&D Department, Large Product Line, ODM (Original Designing & Manufacturing), OEM Capability, Production Capacity, Reliability, Reputation |
| Other Competitive Advantages | NA |
| Major Customer | Soprano, European Thermodynamics Ltd. |
| Export Markets | Australasia, Central/South America, Eastern Europe, Mid East/Africa, North America, Western Europe |








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|
Model |
IN00051 |
|
CPU Socket |
AMD SP3 ILM |
|
Solution3U |
Server and Up ( Active ) |
|
Dimensions |
130.0 x 100.0 x 90.0 mm |
|
TDP |
165W |
|
Material |
AL Base + Cu Block + AL Fin + Heatpipe + 12025 Fan |
|
Thermal Grease |
Shin-Etsu X23-7762 |
|
Material |
Precious Metals,Copper,Brass,Steel Alloys,Hardened Metals,Aluminum,Stainless Steel,Bronze …etc |
|
Dimension |
customized |
|
Tolerance |
+/- 0.005--0.02mm / can also be customized. |
|
Prototype |
accepted |
|
Surface treatment |
Anodize |
|
Processing |
laser cuting,stamping,bending,punching,CNC machining, die-casting, forming, tooling, milling, grinding,tapping,riveting,welding |
|
Package |
polybag/caron/wooden-case |
|
Lead time |
3-15days |
|
Application |
Led Lighting cooler |
|
Equipment |
laser cutting machine, Japan Murata CNC punch, CNC Bending Machine, Large hydraulic press machine600-1200T Squeeze riveter Taiwan punch machine, CNC machining center, Precision miller, Grinder, Driller, Multi-spindle tool, argon welding/carbon dioxide welding/AC welding machine, Pipe cutting/bending |
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