How to design the routing to enhance the heat dissipation of multiple IGBTs on a single heat sink?

As a leading supplier of IGBT Heat Sink Routing, I've witnessed firsthand the critical role that effective heat dissipation plays in the performance and longevity of multiple IGBTs on a single heat sink. In this blog, I'll share some insights on how to design the routing to enhance heat dissipation, leveraging our expertise and the high - quality products we offer.

Understanding the Heat Dissipation Challenges of Multiple IGBTs

Multiple IGBTs on a single heat sink face unique heat dissipation challenges. Each IGBT generates heat during operation, and if not managed properly, the accumulated heat can lead to overheating, which in turn reduces the efficiency of the IGBTs and may even cause premature failure. The heat distribution across the heat sink is often non - uniform, with hotspots forming near high - power IGBTs.

Key Considerations in Routing Design for Heat Dissipation

1. Layout of IGBTs on the Heat Sink

The physical arrangement of IGBTs on the heat sink is crucial. We should try to space them out evenly to ensure a more uniform heat distribution. Avoid clustering high - power IGBTs together, as this can create concentrated hotspots. For example, if we have four IGBTs, a square - like layout with equal spacing between them can help to spread the heat more evenly across the heat sink surface.

2. Routing Path for Heat Transfer

The routing design should facilitate the smooth transfer of heat from the IGBTs to the heat sink and then to the surrounding environment. One effective approach is to use high - thermal - conductivity materials for the routing. Copper is a popular choice due to its excellent thermal conductivity. We offer Copper Skiving Heat Exchanger Heat Pipe Cu Radiator Heat Sink, which uses advanced copper skiving technology to enhance heat transfer. The heat pipes in this product can quickly transfer heat from the IGBTs to the radiator fins, where it can be dissipated more efficiently.

3. Minimizing Thermal Resistance

Thermal resistance is the opposition to heat flow. To enhance heat dissipation, we need to minimize the thermal resistance in the routing path. This can be achieved by ensuring good contact between the IGBTs and the heat sink. Using thermal interface materials (TIMs) such as thermal paste or thermal pads can fill in the microscopic gaps between the IGBTs and the heat sink, reducing the thermal resistance. Additionally, the routing should be designed to have a short and direct path for heat transfer, avoiding unnecessary bends or constrictions that can increase thermal resistance.

4. Airflow Consideration

Airflow plays a vital role in heat dissipation. The routing design should not obstruct the natural airflow around the heat sink. We can design the heat sink with fins that are oriented in the direction of the airflow. For example, in a forced - air cooling system, the fins should be parallel to the direction of the air movement. Our Clu048 /058 75 - 85W 163mm RadiatorHeat Sink is designed with optimized fin structures to promote better airflow and heat dissipation.

Advanced Routing Techniques for Enhanced Heat Dissipation

1. Parallel Routing

Parallel routing can be used to distribute the heat load more evenly. Instead of having a single routing path for all the IGBTs, we can design multiple parallel paths. This way, each IGBT can transfer heat independently, reducing the risk of overloading a single routing path.

2. Hierarchical Routing

Hierarchical routing involves creating a multi - level routing structure. At the first level, heat is transferred from the IGBTs to local heat - transfer elements, and then at the second level, the heat is aggregated and transferred to the main heat sink. This approach can effectively manage the heat generated by multiple IGBTs and improve the overall heat dissipation efficiency.

Case Studies: Successful Routing Designs

Let's take a look at some real - world examples of successful routing designs for multiple IGBTs on a single heat sink.

In a power electronics application, a customer had a set of six IGBTs on a single heat sink. By using our Extrusion Heat Sink 6063 for Thermoelectric Cooler and implementing a parallel routing design, they were able to reduce the maximum temperature of the IGBTs by 15°C compared to their previous design. The even spacing of the IGBTs and the optimized fin structure of the heat sink allowed for better airflow and heat dissipation.

Conclusion

Designing the routing to enhance the heat dissipation of multiple IGBTs on a single heat sink requires a comprehensive understanding of heat transfer principles and careful consideration of various factors such as layout, material selection, and airflow. As an IGBT Heat Sink Routing supplier, we are committed to providing high - quality products and professional solutions to meet the diverse needs of our customers.

If you are looking for reliable heat sink routing solutions for your IGBT applications, we invite you to contact us for procurement and further discussions. Our team of experts is ready to assist you in finding the most suitable products and designs for your specific requirements.

References

1. Incropera, F. P., & DeWitt, D. P. (2002). Fundamentals of heat and mass transfer. John Wiley & Sons.
2. Kakac, S., & Pramuanjaroenkij, A. (2005). Heat exchangers: Selection, rating, and thermal design. CRC Press.