CPU Heat Sink Heat Exchanger Radiator

Aluminum extrusion:

1. Alloy: 6063 T5/6061-T6 are available.
2.Finishing process : cutting,lathing,milling,drilling,tapping,punching,CNC machining,anodizing(natural color,silver,black,gold etc.),powder coating,brushing,deburring are available.
3. Price and produce according to drawing and sample.
4. Packing method: According to customer's requests

Advantage:
A.Precious machining and cutting: length tolerance can be 0.2-0.5 mm, hole tolerance can be 0.05mm.
B.All processes covering extruding,milling,machining and surface treatment are in the same factory to ensure to the good quality and lead time.
C.All OEM and ODM are welcome.
D.The highly difficult products, we have done well.
E.We are skilled in customizing according to CAD drawing,three D design and sample provided by customers and controlling strictly in quality.

1、 Product Introduction

Ceramic products are green and environmentally friendly materials, belonging to a microporous structure, which can increase the porosity by 30% per unit area, greatly increasing the heat dissipation area in contact with air and enhancing its heat dissipation effect. At the same time, its thermal capacity is small, and its own heat storage capacity is small. Its heat can be transmitted to the outside world more quickly. The main features of this product are environmental protection, insulation resistance to high voltage, efficient heat dissipation, and avoiding the breeding of EMI problems.

Ceramic products are mainly used in network communication products, flat panel TVs, drive power supplies, and

Related to the electronics industry, it can effectively solve the heat conduction and dissipation problems in the electronics and home appliance industry. At the same time, it is particularly suitable for products with small to medium watt power consumption and design space that emphasizes light, thin, short, and small. It can provide technical support and applications for the innovation and development of electronic products.

Specification for use of ceramic heat sink adhesive backing

The adhesive patch matched with the ceramic heat sink belongs to the pressure-sensitive thermal conductive adhesive with a substrate, which is suitable for the thermal conductive medium between the ceramic heat sink and the IC surface. It has good thermal conductivity and adhesion performance, and is easy to construct.

1. Tear off the release paper at the bottom of the adhesive patch;

Avoid touching the adhesive patch with fingers or other foreign objects to reduce adhesion due to dust contamination.

2. The ceramic heat sink is smoothly attached to the IC;

Apply an average pressure of about 15ps (1.05kg/cm2) using a roller or other means (such as a scraper) to ensure that the adhesive patch can adhere evenly to the IC surface.

3. After the adhesive patch is attached to the IC, it should remain stationary for at least 1 hour; Do not pull, rotate, or move the heat sink during stationary time, as this will damage the adhesion of the adhesive patch and cause it to lose its adhesion. The closer the adhesive is to the surface of the IC, the less likely it is to fall off.

Precautions:

※ The back adhesive patch can only be assembled after high-temperature operations such as soldering.

※ The adhesive must be kept dry and clean

Basic Information

Trading Capabilities

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